Development of an Automated Via Inspection Station

> Nuclear Propulsion Program, Brigham Young University
> 0
> Todd Romney, Robert H. Todd

Next Generation Ceramic Multilayer Systems

> DuPont iTechnologies, Microcircuit Materials
> 0
> R.J. Bacher, Y.L. Wang, M.A. Skurski, J.C. Crumpton, K.M. Nair

High Density MCM-C Utilizing Tape Dielectric and Photopatterning Processes

> Heraeus Inc., Scrantom Engineering Inc.
> 0
> Michael P. O'Neill, Peter G. Barnwell, Steven Scrantom, Gregory Gravier

Viscous flow as the driving force for the densification of low-temperature co-fired ceramics

> J AM CERAM SOC 90 (1): 64-70 JAN 2007
> 2007
> Kemethmuller, S, Author Kemethmueller Stefan Kemethmueller, Stefan , Hagymasi, M, et al.

Linear tapered cavity-backed slot antenna for millimeter-wave LTCC modules

> IEEE ANTENN WIREL PR 5: 175-178 2006
> 2007
> Kim, IK, Author, Reprint Author Kim Il Kwon Kim, Il Kwon , Kidera, N, et al.

Factors influencing the green body properties and shrinkage tolerance of LTCC green tapes

> INT J APPL CERAM TEC 4 (1): 53-59 2007
> 2007
> Besendorfer, G, Author, Reprint Author Besendoerfer Georg Besendoerfer, Georg , Roosen, A, et al.

Hot embossing: An alternative method to produce cavities in ceramic multilayer

> INT J APPL CERAM TEC 4 (1): 38-46 2007
> 2007
> Rabe, T, Author, Reprint Author Rabe Torsten Rabe, Torsten , Kuchenbecker, P, et al.

Middle- and high-permittivity dielectric compositions for low-temperature co-fired ceramics

> J EUR CERAM SOC 27 (4): 2017-2024 2007
> 2007
> Choi, YJ, Author Choi Young-Jin Choi, Young-Jin , Park, JH, et al.

A miniature bio-inspired optic flow sensor based on low temperature co-fired ceramics (LTCC) technology

> SENSOR ACTUAT A-PHYS 133 (1): 88-95 JAN 8 2007 2007
> 2007
> Pudas, M, Author Pudas Marko Pudas, Marko , Viollet, S, et al.

Package-level integrated LTCC antenna for RF package application

> IEEE T ADV PACKAGING 30 (1): 132-141 FEB 2007
> 2007
> Wi, SK, Author, Reprint Author Wi Sang-Kyuk Wi, Sang-Kyuk , Kim, JS, et al.

Analysis and application of 3-D LTCC directional filter design for multiband millimeter-wave integrated module

> IEEE T ADV PACKAGING 30 (1): 124-131 FEB 2007
> 2007
> Sarkar, S, Author, Reprint Author Sarkar Saikat Sarkar, Saikat , Pinel, S, et al.

Ultra-wideband LTCC ridge waveguide filters

> IEEE MICROW WIREL CO 17 (2): 115-117 FEB 2007
> 2007
> Ruiz-Cruz, JA, Author, Reprint Author Ruiz-Cruz Jorge A. Ruiz-Cruz, Jorge A. , Zhang, YC, et al.

Thick-film PTC thermistors and LTCC structures: The dependence of the electrical and microstructural characteristics on the firing temperature

> J EUR CERAM SOC 27 (5): 2237-2243 2007
> 2007
> Hrovat, M, Author, Reprint Author Hrovat Marko Hrovat, Marko , Belavic, D, et al.

Characterization and wideband modeling of miniaturized LTCC helical inductors

> IEEE MICROW WIREL CO 17 (3): 160-162 MAR 2007
> 2007
> Heo, K, Author, Reprint Author Heo Keun Heo, Keun , Lim, J, et al.

Effect of frit size on microwave properties of glass-ceramic in low temperature co-fired ceramics

> THERMOCHIM ACTA 455 (1-2): 119-122 Sp. Iss. SI APR 1 2007
> 2007
> Hwang, S, Author Hwang Seongjin Hwang, Seongjin , Kim, H, et al.

Fabrication of a millinewton force sensor using low temperature co-fired ceramic (LTCC) technology

> SENSOR ACTUAT A-PHYS 134 (2): 334-338 MAR 15 2007
> 2007
> Birol, H, Author, Reprint Author Birol Hansu Birol, Hansu , Maeder, T, et al.

Low profile integratable inductor fabricated based on LTCC technology for microprocessor power delivery applications

> IEEE T COMPON PACK T 30 (1): 170-177 MAR 2007
> 2007
> Lim, MHF, Author, Reprint Author Lim Michele Hui Fem Lim, Michele Hui Fem , Liang, ZX, et al.

An LTCC-based wireless transceiver for radio-over-fiber applications

> IEEE T MICROW THEORY 55 (3): 579-587 MAR 2007
> 2007
> Pergola, L, Author, Reprint Author Pergola Luca Pergola, Luca , Gindera, R, et al.

A cost-effective transition between a microstrip line and a post-wall waveguide using a laminated LTCC substrate in 60-GHz band

> IEICE T ELECTRON E90C (4): 907-910 APR 2007
> 2007
> Kai, T, Author, Reprint Author Kai Takafumi Kai, Takafumi , Hirokawa, J, et al.

Broadband cascade quadruplet bandpass filter with low-temperature co-fired ceramic technology

> IEEE MICROW WIREL CO 17 (5): 340-342 MAY 2007
> 2007
> Tang, CW, Author, Reprint Author Tang Ching-Wen Tang, Ching-Wen , Shen, CW, et al.

Sub-critical crack growth behavior of a low-temperature co-fired ceramic

> J AM CERAM SOC 90 (5): 1527-1533 MAY 2007
> 2007
> Tandon, R, Author, Reprint Author Tandon Rajan Tandon, Rajan , Newton, CS, et al.

Microwave dielectric properties of Mg-3(VO4)(2)-xBa(3)(VO4)(2) ceramics for LTCC with near zero temperature coefficient of resonant frequency

> J EUR CERAM SOC 27 (8-9): 3099-3104 Sp. Iss. SI 2007
> 2007
> Ogawa, H, Author, Reprint Author Ogawa Hirotaka Ogawa, Hirotaka , Yokoi, A, et al.

Low temperature sintering and microwave dielectric properties of Ba3Ti5Nb6O28 with ZnO-B2O3 glass additions for LTCC applications

> J EUR CERAM SOC 27 (8-9): 3075-3079 Sp. Iss. SI 2007
> 2007
> Kim, JR, Author Kim Jeong-Ryeol Kim, Jeong-Ryeol , Kim, DW, et al.

Printable resistors in LTCC systems

> J EUR CERAM SOC 27 (8-9): 2953-2956 Sp. Iss. SI 2007
> 2007
> Lahti, M, Author, Reprint Author Lahti Markku Lahti, Markku , Vimpari, A, et al.

Embedded air cavity backed microstrip antenna on an LTCC substrate

> J EUR CERAM SOC 27 (8-9): 2881-2885 Sp. Iss. SI 2007
> 2007
> Komulainen, M, Author, Reprint Author Komulainen M. Komulainen, M. , Mahonen, J, et al.

Aerosol deposition for post-LTCC

> J EUR CERAM SOC 27 (8-9): 2789-2795 Sp. Iss. SI 2007
> 2007
> Imanaka, Y, Author, Reprint Author Imanaka Yoshihiko Imanaka, Yoshihiko , Hayashi, N, et al.

LTCC system with new high-epsilon(r) and high-Q material co-fired with conventional low-epsilon(r) base material for wireless communications

> J EUR CERAM SOC 27 (8-9): 2785-2788 Sp. Iss. SI 2007
> 2007
> Higuchi, Y, Author, Reprint Author Higuchi Yukio Higuchi, Yukio , Sugimoto, Y, et al.

Characteristics of thick film resistors embedded in low temperature co-fired ceramic (LTCC) substrates

> J EUR CERAM SOC 27 (8-9): 2779-2784 Sp. Iss. SI 2007
> 2007
> Hsi, CS, Author, Reprint Author Hsi Chi-Shiung Hsi, Chi-Shiung , Hsieh, FM, et al.

The electromagnetic properties of Cu-substituted garnets with low sintering temperature

> J EUR CERAM SOC 27 (8-9): 2771-2777 Sp. Iss. SI 2007
> 2007
> Ganne, JP, Author, Reprint Author Ganne Jean-Pierre Ganne, Jean-Pierre , Lebourgeois, R, et al.

ZnTiO3 ceramic sintered at low temperature with glass phase addition for LTCC applications

> MATER CHEM PHYS 103 (1): 106-111 MAY 15 2007
> 2007
> Chaouchi, A, Author Chaouchi A. Chaouchi, A. , d'Astorg, S, et al.

Fabrication of RF-MEMS switches on LTCC substrates using PECVD a-Si as sacrificial layer

> MICROELECTRON ENG 84 (5-8): 1401-1404 MAY-AUG 2007
> 2007
> Cianci, E, Author, Reprint Author Cianci E. Cianci, E. , Coppa, A, et al.

A multi-sensor biological monitoring module built up in LTCC-technology

> MICROELECTRON ENG 84 (5-8): 1240-1243 MAY-AUG 2007
> 2007
> Smetana, W, Author, Reprint Author Smetana Walter Smetana, Walter , Balluch, B, et al.

Aspects of micro structuring low temperature co-fired ceramic (LTCC) for realisation complex 3D objects by embossing

> MICROELECTRON ENG 84 (5-8): 1198-1201 MAY-AUG 2007
> 2007
> Andrijasevic, D, Author, Reprint Author Andrijasevic Daniela Andrijasevic, Daniela , Smetana, W, et al.

Design of vertically stacked waveguide filters in LTCC

> IEEE T MICROW THEORY 55 (8): 1771-1779 AUG 2007
> 2007
> Shen, TM, Author, Reprint Author Shen Tze-Min Shen, Tze-Min , Chen, CF, et al.

PZT thick films for sensor and actuator applications

> J EUR CERAM SOC 27 (13-15): 4177-4180 2007
> 2007
> Gebhardt, S, Author, Reprint Author Gebhardt Sylvia Gebhardt, Sylvia , Seffner, L, et al.

Characteristics of piezoelectric cantilevers embedded in LTCC

> J EUR CERAM SOC 27 (13-15): 4135-4138 2007
> 2007
> Heinonen, E, Author, Reprint Author Heinonen Esa Heinonen, Esa , Juuti, J, et al.

Microwave dielectric properties of MgCO2(VO4)(2) ceramics synthesized by a sol-gel method

> J EUR CERAM SOC 27 (13-15): 3855-3859 2007
> 2007
> Bang, J, Author, Reprint Author Bang Jaecheol Bang, Jaecheol

Dielectric properties and phase transitions of Bi3Nb1-xTaxO7 fluorite-type dielectrics

> J EUR CERAM SOC 27 (13-15): 3843-3846 2007
> 2007
> Pirnat, U, Author, Reprint Author Pirnat Ursa Pirnat, Ursa , Suvorov, D, et al

Design of a dual-band bandpass filter with low-temperature co-fired ceramic technology

> IEEE T MICROW THEORY 54 (8): 3327-3332 AUG 2006
> 2006
> Tang, CW, Author, Reprint Author Tang Ching-Wen Tang, Ching-Wen , You, SF, et al.

Broad-band vertical interconnect between multilayer modules using double current probes

> INT J INFRARED MILLI 27 (2): 261-271 FEB 2006
> 2006
> Xia, L, Author, Reprint Author Xia Lei Xia, Lei , Xu, RM, et al.

Effect of friction on inhomogeneous shrinkage behavior of structured LTCC tapes

> J AM CERAM SOC 89 (9): 2731-2737 SEP 2006
> 2006
> Pohle, D, Author Pohle Dirk Pohle, Dirk , Wagner, M, et al.

A mechanism for low-temperature sintering

> J EUR CERAM SOC 26 (13): 2777-2783 SEP 2006
> 2006
> Valant, M, Author, Reprint Author Valant Matjaz Valant, Matjaz , Suvorov, D, et al.

Thermal and flow performance of a microconvective heat sink with three-dimensional constructal channel configuration

> J HEAT TRANS-T ASME 128 (8): 740-751 AUG 2006
> 2006
> Moreno, RM, Author, Reprint Author Moreno R. M. Moreno, R. M. , Tao, YX, et al.

Double-stacked EBG structure for wideband suppression of simultaneous switching noise in LTCC-based SiP applications

> IEEE MICROW WIREL CO 16 (9): 481-483 SEP 2006
> 2006
> Park, J, Author, Reprint Author Park Jongbae Park, Jongbae , Lu, ACW, et al.

An integrated LTCC inductor embedding NiZn ferrite

> IEEE T MAGN 42 (10): 2840-2842 OCT 2006
> 2006
> Kim, HJ, Author, Reprint Author Kim Hee-Jun Kim, Hee-Jun , Kim, YJ, et al.

The development of micro-fuel processor using low temperature co-fired ceramic (LTCC)

> INT J HYDROGEN ENERG 31 (13): 1925-1933 OCT 2006
> 2006
> Shin, Y, Author Shin Yeena Shin, Yeena , Kim, O, et al.

LTCC meso-analytical system for chloride ion determination in drinking waters

> SENSOR ACTUAT B-CHEM 118 (1-2): 67-72 OCT 25 2006
> 2006
> Ibanez-Garcia, N, Author Ibanez-Garcia N. Ibanez-Garcia, N. , Goncalves, RDM, et al.

LTCC-based microchips for the electrochemical detection of phenolic compounds

> SENSOR ACTUAT B-CHEM 120 (1): 346-351 DEC 14 2006
> 2006
> Goldbacha, M, Author Goldbacha Marc Goldbacha, Marc , Axthelm, H, et al.

A fully embedded 60-GHz novel BPF for LTCC system-in-package applications

> IEEE T ADV PACKAGING 29 (4): 804-809 NOV 2006
> 2006
> Lee, YC, Author, Reprint Author Lee Young Chul Lee, Young Chul , Park, CS, et al.

Properties of lead zirconate titanate thick-film piezoelectric actuators on ceramic substrates

> INT J APPL CERAM TEC 3 (6): 448-454 2006
> 2006
> Belavic, D, Author, Reprint Author Belavic Darko Belavic, Darko , Zarnik, MS, et al.

Influences of the glass phase on densification, microstructure, and properties of low-temperature co-fired ceramics

> 2006
> 2006
> Eberstein, M, Author, Reprint Author Eberstein Markus Eberstein, Markus , Rabe, T, et al.

Fabrication of a multilayered low-temperature cofired ceramic micro-plasma-generating device

> 2006
> 2006
> Baker, A, Author, Reprint Author Baker Amanda Baker, Amanda , Randall, C, et al.

Low-loss passive alignment of single-mode fibers in low-temperature cofired ceramics using CO2 laser fabricated U-grooves

> APPL OPTICS 45 (36): 9168-9175 DEC 20 2006
> 2006
> Nowak, KM, Author, Reprint Author Nowak K. M. Nowak, K. M. , Baker, HJ, et al.

A broadband single-stage equivalent circuit for Modeling LTCC bandpass

> IEEE T MICROW THEORY 54 (12): 4412-4421 Part 2 DEC 2006
> 2006
> Tsai, YS, Author, Reprint Author Tsai Yu-Shun Tsai, Yu-Shun , Horng, TS, et al.

LTCC-based highly integrated millimeter-wave receiver front-end module

> INT J INFRARED MILLI 27 (7): 975-983 JUL 2006
> 2006
> Xia, L, Author, Reprint Author Xia Lei Xia, Lei , Xu, RM, et al.

Processing and Electrical Charasterisation of Co-sintered Mixed-permittivity Multi-layer Ceramics

> SIMTech
> 2006
> P.L. Vadiveloo, V. Sunappan, L.L. Wai, W. Fan, C.W. Lu

Cold Processing of Green State LTCC with a CO2 Laser

> Applied Physics A, Material Science & Processing
> 2006
> K.M. Nowak, H.J. Baker, D.R. Hall

Processing of Graphite-based Sacrificial Layer for Microfabrication of Low Temperature Co-fired Ceramics (LTCC)

> Sensors and Actuators
> 2006
> Hansu Birol, Thomas Maeder, Peter Ryser

Material Properties and RF Applications of High k and Ferrite LTCC Ceramics

> Science Direct, Microelectronic Reliability
> 2006
> M. Matters-Kammerer, U. Mackens, K. Reimann, R. Pietig, D. Hennings, B. Schreinemacher, R. Mauczok, S. Gruhlke, C. Martiny

Burr Formation During Micro Via-hole Punching Process of Ceramic and PET Double Layer Sheet

> Int J Adv Manuf Technol
> 2006
> S.H. Rhim, S.Y. Shin, B.Y. Joo, S.I. Oh

Integrated LTCC Modules by Laminating and Co-firing Tapes Directly on Heat Sink

> Proceedings of the 36th European Microwave Conference
> 2006
> Markku Lahti, Kari Kautio, Pentti Karioja

Flexible Circuit Technology

> BR Publishing
> 2006
> Joseph Fjelstad

Direct Writing of Conventional Thick Film Inks Using MAPLE-DW Process

> Journal of Laser Micro/Nanoengineering
> 2006
> Edward C. Kinzel, Xianfan Xu, Brent R. Lewis, Normand M. Laurendeau and Robert P. Lucht

Implementation of Sintered LTCC for The Fabrication of a 3D Cylindrical Micro Combustor

> University of Pennsylvania
> 2006
> Jose M. Castillo Colon

Advanced Electrical and Stability Characterization of Untrimmed and Variously Trimmed Thick-film and LTCC Resistors

> Microelectronics Reliability
> 2006
> Andrzej Dziedzic, Andrzej Kolek, Waleed Ehrhardt, Heiko Thust

Low-loss Passive Alignment of Single-mode Fibers in LTCC Using CO2 Laser Fabricated U-grooves

> Departman of Physics, School of Engineering and Physical Sciences
> 2006
> K. Nowak, H. Baker, D. Hall, X. Liu, A. Bell

Technology and Applications of Low Temperature Cofired Ceramic (LTCC) Based Sensors and Microsystems

> Bulletin of The Polish Academy of Sciences
> 2006
> L.J. Golonka

Fiber Pigtailed Multimode Laser Module Based on Passive Device Alignment on an LTCC Substrate

> IEEE Transactions on Advenced Packaging
> 2006
> Kimmo Karenan, Jukka-Tapani Makinen, Kari. T. Kautio, Jyrki Ollila, Jarno Petaja, Veli Heikkinen, Juhani Heilala, Pentti Karioja

Fabrication of Microvias for Multilayer LTCC Substrates

> IEEE Transactions on Electronics Packaging Manufacturing
> 2006
> Gangqiang Wang, Erica C. Folk, Fred Barlow, Aicha Elshabini

Development and Processing of an Anodic Bondable LTCC Tape

> EMPC
> 2005
> E. Müller, T. Bartnitzek, F. Bechtold, B. Pawlowski, P. Rothe, R. Ehrt, A. Heymel, E. Weiland, T. Schroeter, S. Schundau, K. Kaschlik

Study on The Implementation of Sintered LTCC and Graphite as a Sacrificial Material for The Fabrication Microcombustors

> University of Pennsylvania
> 2005
> Miguel Pérez Tolentino

Development and Evaluation of Hermetic Ceramic Microwave Packages for Space Applications

> Micro Systems Engineering GmbH, RHe Microsystems GmbH, Technical University of Ilmenau
> 2005
> Jens Müller, Jürgen Pohlner, Dieter Schwanke, Günter Reppe, Heiok Thust, Ruben Perrone

Laser Microfrabrication of Thick-Film Microelectronics

> Purdue University
> 2005
> Edward C. Kinzel

LTCC Modules for a Multiple Phase Shifter with RF-MEMS Switch Integration

> European Microelectronics and Packaging Conference
> 2005
> Thomas Bartnitzek, Edda Müller, Raymond van Dijk

LTCC Multi-layer Substrate Utilized with Ink-jet and Thin Film Fine Pattering Technology

> KOA Corporation
> 2005
> Koji Koiwai

Succes in The Development of Fine-line Wiring Pattern Formation Technology With The Use of Inkjet Method on Low Temperature Co-Fired Ceramics Multi-Layer Board

> KOA Corporation
> 2005
> Yonezawa, Yajima

Materials for Inductive and Microwave Function Integration in LTCC-Technology Multichip Modules

> Journal of Pysics
> 2005
> V.T. Zaspalis, M. Kolenbrander, J. Boerekemap

Improving Packaging and Increasing The Level of Integration in Power Electronics

> Technische Universiteit Delft
> 2005
> Jelena Popovic

Influence of Processing and Conduction Materials on Properties of Co-fired Resistors in LTCC Stuctures

> Journal of the European Ceramic Society
> 2005
> H. Birol, T. Maeder, P. Ryser

Investigation of Interactions between co-fired LTCC Components

> Journal of the European Ceramic Society
> 2005
> H. Birol, T. Meader, C. Jacq, P. Riser

Low Temperature Co-fired Ceramic (LTCC) Technology for RF Multi-layer Circuit

> Applications-Technology and Modeling
> 2005
> Aly E. Fathy

Technology and Infrastructure for Embedded Passive Components

> PCB Fabrication
> 2005
> David J. Pedder

A Mechanism for Low-temperature Sintering

> Journal of The European Ceramic Societz
> 2005
> Matjay Valant, Danilo Suvorov, Robert C. Pullar, Kumaravinothan Sarma, Neil McN. Alford

Lases-Induced Surface Activation of LTCC Materials for Chemical Metallization

> IEEE Transactions on Advenced Packaging
> 2005
> K. Kordás, A.E.Pap, J. Saavalainen, H. Jantunen, P. Moilanen, E. Haapaniemi, and s. Leppavuori

Design of a Microstrip Fed Circularly Polarised Printed Antenna for an AEHF Phased Array

> Defence R&D Canada
> 2004
> Michel Clénet

Optimization of Thermal Behavior For Resistors in LTCC and Possibilities to Increase The Performance

> Technical University of Ilmenau
> 2004
> Heiko Thust, Torsten Kirchner

Advanced LTCC Processes Using Pressure Assisted Sintering

> Technical University of Ilmenau, ATV GmbH
> 2004
> Michael Hintz, Heiko Thust, Arne Albrecht, Russi Tschernev

LTCC Based Technology for 3D Formed Modules

> Journal of Electrical Engineering
> 2004
> Stanislav Slosarcik, Jan Urbancik, Alena Pietrikov??, Juraj Bansky, Reinhard Bauer

Process Issues and Characterization of LTCC Substrates

> Electronic Components and Technology Conference
> 2004
> Vasudivan Sunappan, Arulvanan Periannan, Chua Kai Meng, Wong Chee Khuen

Integrated Substrate Technology

> Electronic Components and Technology Conference
> 2004
> Rajen Chanchani, Donald T. Bethke, Denise B. Webb, Charlie Sandoval, Gregg Wouters

Laser Processing – The Future of HDI Manufacturing

> Coherent Inc.
> 2004
> Sri Venkat, Terry Hannon

Integrated Passive Components: A Brief Overview of LTCC Surface Mount and Integral Options

> Kyocera America
> 2004
> A.J. Piloto

Integral, Embedded, and Buried Passive Technologies

> X
> 2004
> Margaret Jackson, Michael Pecht, Soon Bok Lee and P. Sandborn

Designing for High Frequency with DuPont Green Tape

> DuPont
> 2004
> DuPont

Interconnection Substrates – Ceramic

> IMAPS
> 2004
> Howard Imhof, Ton Schless

Automating and Optimizing High Performance LTCC Design

> Microwave Journal
> 2004
> Aki Nakatani, Lawrence Williams

Materials Compatibility Issues in LTCC Technology and Their Effects on Structural and Electrical Properties

> Ecole Polytechnique Fédérale de Lausanne
> 2004
> H. Birol, T. Maeder, P. Ryser

Lifetime Prediction for Mechanically Stressed Low Temperature Co-fired Ceramics

> Journal of The European Ceramic Society
> 2004
> Henning Danheim, Ulrich Schmid, Andreas Roosen

LTCC and Thick-Film Microresistors

> Electronics Technology Laboratory, Dresden University of Technology
> 2004
> Andrejz Dziedzic, Edward Mis, Lars Rebenklau, Klaus-Jurgen Wolter

New Materials and Technologies

> Bulletin of The Polish Academy of Sciences
> 2004
> R. Pampuch

Design Aspect of Microwave Components with LTCC Technique

> Journal of the European Society
> 2003
> H. Jantunen, T. Kangasvieri, J. Vahakangas, S. Leppavuori

Wireless Ceramic Sensors Operating in High Temperature Environments

> American Institute of Aeronautics and Astronautics
> 2003
> Edward D. Birdsell, Jin-Woo Park, Mark G. Allen

Thick-film Resistors on Various Substrates as Sensing Elements for Strain-gauge Applications

> Science Direct, Sensors and Actuators
> 2003
> Marko Hrovat, Darko Belavic, Andreja Bencan, Janey Bernard, Janey Holc, Jena Cilensek, Walter Smetana, Heinz Homolka, Roland Reicher, Leszek Golonka, Andrzej Dziedzic, Jaroslaw Kita

Generic Investigation on 0-Shrinkage Processed LTCC

> Technical University of Ilmenau, DuPont
> 2003
> Michael Hintz, Heiko Thust, Erich Polzer

Reliability Investigations of BGA-Interconnections between RF-LTCC-Modules and PCBs

> 14th European Microelectronics and Packaging Conference & Exhibition
> 2003
> Dieter Schwanke, Thomas Haas, Christian Zeilmann, Klaus Halser, Matthias Klein

Application of Neural Network on LTCC Fine Line Screen Printing Process

> Material Researh Laboratories, Industrial Technology Research Institute
> 2003
> Chiu, Kuo-Chaung

High Frequency Performance Characterisation of HeraLock HL2000 Zero Shrink Low Temperature Cofire Ceramic

> VTT Electronics
> 2003
> Frans Lautzenhiser, Quentin Reynolds, Markku Lahti, Kari Kautio

Evolution of LTCC Technology for Industrial Applications

> CMAC Microtechnology
> 2003
> Michael Massiot

LTCC Systems for Low GHz Frequencies - a Study of The Critical Properties and Their Measurement Techniques

> Heraeus Circuit Materials Division
> 2003
> Peter Barnwell, Quentic Reynolds, Charless Free, Zhengrong Tian

Shaping Ceramics in Small Scale - From microcomponents to Gas Sensor

> Swiss Federal Institute of Technology Zurich
> 2003
> Martin Heule

Design Capabilities and Microwave Performance of Thin Film on LTCC

> Micro Systems Engineering GmbH & Co., Reinhard Microtech AG, EADS Deutchland GbmH
> 2003
> Jens Müller, Dieter Schwanke, Thomas Haas, Ernst Feuer, Bernanrd Schweizer, Andreas Klaassen

Comparison of LTCC Passive Components in Different Structure

> International Conference on Electronics Packaging
> 2003
> Takeshi Hanawa, Ilkka Urvas

Laser Direct-write and its Application in Low Temperature Co-fired Ceramic (LTCC) Technology

> Microelectronic Engineering
> 2003
> Chengping Zhang, David Liu, Scott A. Mathews, John Graves, Timothy M. Schaefer, Barry K. Gilbert, Rohit Modi, Huey-Daw Wu, Douglas B. Chrisey

Wire Bonding Characteristics of Gold Conductors for Low Temperature Co-fired Ceramic Applications

> Microelectronics Reliability
> 2003
> Cristina Lopez , Liang Chai, Aziz Shaikh, Vern Stygar

Lead Free, Zero Shrink, Substrate Bonded LTCC System

> Electro-Science Laboratories
> 2003
> R.L. Wahlers, A.H. Feingold and M. Heinz

Lead Free Dielectric and Magnetic Materials for Integrated Passives

> Electro-Science Laboratories
> 2003
> R.L. Wahlers, M. Heinz, A.H. Feingold

High Level of Integration for Bluetooth Modules on LTCC

> 14th European Microelectronics and Packaging Conference & Exhibition
> 2003
> R Kulke, V. Wahle, D. Sollbach, P. Uhlig, M. Rittweger, S.-P. Schmitz, P. Waldow

Constrained-sintered, Low-temperature Co-fired Ceramic for IC Packaging Applications

> DuPont Electronic Technologies
> 2003
> Christopher R. Needes, Michael F. Barker, Patricia T. Olliver, Kenneth W. Hang, Kenneth E. Souders, Carl B. Wang, Michael A. Smith

Processing of LTCC with Embedded RuO2-based Resistors

> Materials Chemistry and Physics
> 2002
> Chi-Shuing Hsi, De-Fuang Chen, Fang-Min Shieh, Shen-Li Fu

High Performance Thermal Vias in LTCC Substrates

> Inter Society Conference on Thermal Phenomena
> 2002
> Marc A. Zampino, Ravindra Kandukuri, W. Kinzy Jones

Measurement of Loss Tangent and Relative Permittivity of LTCC Ceramics at verying Temperatures and Frequencies

> European Journal of Ceramic Society
> 2002
> Janina Mazierska, Mohan V. Jacob, Andrew Harring, Jerzy Krupka, Peter Barnwell, Theresa Sims

A Comparison of Microsrip Models to Low Temperature Co-fired Ceramic - Silver Microstrip Measurements

> Microelectronics Journal
> 2002
> Andrew A. Shapiro, Martha L. Mecarney, Henry P. Lee

Integrated Capacitors using LTCC

> Micro Systems Engineering GmbH & Co.
> 2002
> Jens Müller, Daniel Josip

Low Profile LTCC Transformers

> Electro Science Laboratories
> 2002
> R.L. Wahlers, C.Y.D. Huang, M.R. Heinz, A.H. Feingold

Microwave Modul Design with HeraLock HL2000 LTCC

> Heraeus CMD
> 2002
> Frans Lauthenhiser, Edmar Amaya, Peter Barnwell, Jim Wood

HeraLock 2000 Self-constrained LTCC Tape

> Heraeus CMD
> 2002
> Frans Lauthenhiser, Edmar Amaya

Passive RF Band-pass Filter sin an LTCC Module Made by Fine-line Thick-film Pastes

> Journal of the European Ceramic Society
> 2001
> Markku Lahti, Vilho Lantto

Multilayer Ceramic Integrated Circuits (MCICs) Technology and Passive Circuit Design

> University College London, Department of Electronic and Electrical Engineering
> 2001
> Sarmad Al-Taei, David Haigh, George Passiopoulos

Dielectric and Conductor-Loss Characterization and Measurements on Electronic Packaging Materials

> National Institute of Standards and Technology
> 2001
> James Baker-Jarvis, Michael D. Janezic, Bill Riddle, Christopher L. Holloway, N.G. Paulter, J.E. Blendell

LTCC - Multilayer Ceramic for Wireless and Sensor Applications

> IMST GmbH
> 2001
> Reinhard Kulke, Matthias Rittweger, Peter Uhlig, Carsten Günner

A Novel Low Temperature Co-firing Ceramic (LTCC) Material for Telecommunication Devices

> Depertment of Electrical Engineering and Infotech Oulu, University of Oulu
> 2001
> Heli Jantunen

Microwave and mm-meter Wave Applications: a New Challenge for Ceramic Thick Film Technology

> DuPont, Micro Systems Engineering GmbH, EADS Deutchland GmbH
> 2001
> Gerard Vanrietvelde, Sebastiano Nicotra, Jens Mueller, Axel Brokmeier

Overview of Low Temperature Co-fired Ceramics Tape Technology for Meso-system Technology

> Sensor and Actuators
> 2001
> M.R. Gongora-Rubio, P. Espinoza-Vallejos, L. Sola-Laguna, J.J. Santiago-Avilés

Through-hole Plugs and Thermal Vias

> DuPont iTechnology
> 2000
> John C. Crumpton, Victoria E. Cofield, Rudolph J. Bacher

Manufacture of Embedded Integrated Passive Components into Low Temperature Co-fired Ceramic Systems

> Scrantom Engineering Inc., Rockwell Science Center
> 2000
> Steve Scrantom, Greg Gravier, Ted Valentine, David Pehlke, Brian Schiffer

LTCC Technology - Where We Are Where We Are Going

> Scrantom Engineering
> 2000
> Charles Q. Scrantom, Gregory J. Gravier

Microstructure and Phase Development of Buried Resistors in Low Temperature Co-Fired Ceramic

> Journal of Electroceramics
> 2000
> Mark A. Rodriguez, Pin Yang, Paul Kotula, Duane Dimos

Photolithographic Feature Fabrication in LTCC

> Electrical Engineering Department, University of Pennsylvania
> 2000
> Patricio Espinoza-Vallejos, Jorge Santiago-Avilés

Development of Model Libraries for Embedded Passives Using Network Synthesis

> IEEE Transactions on Circuit and Systems, Analog and Digital Signal Processing
> 2000
> Kwang Lim Choi, Madhavan Swaminathan

Properties of Laser Cut LTCC Heaters

> Microelectronics Reliability
> 2000
> Jaroslaw Kita, Andrzej Dziedzic, Leszek J. Golonka, Andrzej Bochenek

High Resolution Coplanar Structures on Multilayer LTCC for Applications up to 40 GHz

> 32nd International Symposium on Microelectronics
> 1999
> R. Kulke, M. Rittweger, W. Simon, A. Wien, I. Wolff

Modelling And Simulation of Embedded Passives Using Rational Functions In Multi-Layered Substrates

> Georgia Institute of Technology
> 1999
> Kwang Lim Choi

An LTCC Hybrid Pressure Transducer for High Temperature Applications

> Univerity of Puerto Rico, Sensor Technologies
> 1999
> Jolymar Gonzalez-Esteves, Mayaguez Campus

Photolithographic Proccesses for Creating a Proximity Sensor in Low Temperature Co-Fired Ceramic Tapes

> NSF Summer Undergraduate Fellowships in Sensor Technology
> 1999
> Jason Gillman

Multichip Module Substrates

> Journal Hopkins Apl Technical Digest
> 1999
> Norman A. Blum, Harry K. Charles Jr., A. Shaun Francomacaro

Wafer Scale CSP Technology: Design, Substrate and Manufacturing Requirements

> Micro System Engineering Inc.
> 1998
> J. Müller, T. Haas, M. Harnack, P. Chen, M. Johnson, T.G. Tessier